The limits of second bond placement adjustment and looping adjustment under this constant wire feed mechanism can be programmed by the user.Therefore, this Constant Wire Feed mechanism will have minimal effect on the looping, it will attempt to adjust the second position first and if necessary, minor adjust on the looping.The system will proceed further to adjust the looping to maintain the same amount of wire feed from the system. If the second bond position has already been adjusted to its extreme position and constant wire feed still can not be achieved.Companies operating in this market include ASM Pacific Technology (ASMPT). 17595 Harvard Ave. Home Products Contact Assembly Wafer Foundries Mirror Semiconductor, Inc. If the loop height and the lateral wire length can be maintain at all time, the actual amount of wire feed from the system will remain constant. Manual wire wedge bonder equipment require skilled workforce and are highly. Wire Bonders manual and semi-automatic ball conder and wedge bonder for open cavity QFN packages, Semiconductor and MEMS.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |